Chemical Mechanical Polishing Equipment

CTS Co., Ltd. was founded in 2013 as a semiconductor-production machinery manufacturer, and is a specialized company that manufactures and sells Chemical Mechanical Polishing (CMP) process-equipment used in semiconductor manufacturing through systematic technology and management.
CTS’s development and manufacturing of semiconductor Chemical Mechanical Polishing (CMP) equipment is used for research experiments and material-component development facilities that require precision-polishing processes in research institutes and universities –as well as equipment for manufacturing chips in semiconductor production processes.
The CMP process is a process of flattening the curvature of the wafer surface. The CMP process refers to the process of polishing and planarizing the film surface of a wafer with irregularities or curves using chemical/mechanical elements.

Polishing various products
CTS’s SAERO-K2 CMP equipment polishes various products such as Si, SiC, and glass with wafer sizes of 150 and 200 mm.
As an automated equipment of the wafer dry-in, dry-out type, SAERO-K2has the process performance to control up to the outermost 3 mm of the wafer by optimizing the CMP head, and has excellent cleaning effects due to chemical usage and equipment optimization.
SAERO-K2 features built-in monitoring systems necessary for the CMP process, facilitating data analysis, and providing solutions to meet customer requirements.

With numerous efforts and technological developments, CTS has the technological
competitiveness to stand shoulder-to-shoulder with the world’s best competitors, and it is a growing company that prioritizes customer satisfaction.
“We are committed to continue growing into a company with global competitiveness in the advanced IT industry, with the goal of creating new added value through creative concepts and new technologies, product development, specialized expertise, and product development with customer convenience,” emphasized the company’s CEO.

 
 
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