[INQ. NO. 2305M01] Top Engineering Co., Ltd., a company specializing in display process equipment, recently announced that it had developed vertical micro-LED non-contact inspection equipment.
The inspection equipment developed by Top Engineering simultaneously inspects thousands of micro-LED chips after the wafer-etching process, and detects defective chips. This equipment inspects the electro-optical defects of the vertical micro-LED chips in which the electrodes are arranged in avertical structure in a non-contact manner.
Following the development of 30 micrometers (µm) size horizontal micro-LED non-contact inspection equipment by Top Engineering in 2022, the vertical micro-LED non-contact inspection equipment it has developed this time detects defects in LED chips with a size of 10 micrometers (µm).
Top Engineering’s inspection equipment can detect even specific micro-defects that could not be detected with existing automatic optical inspection (AOI) and photoluminescence spectroscopy (PL) inspection technologies.
Following the development of horizontal micro-LED inspection equipment, Top Engineering is the first to make vertical micro-LED inspection equipment that applies an electro-optical measurement method without direct contact with the microLED chip.
Vertical micro-LED chips can be applied to micro displays such as smart watches.
A spokesperson for the company said, “We are also developing technology that can inspect micro-LED chips with a size of 5 micrometers or less in the future by upgrading our equipment inspection performance.”
Inspection equipment is a device that can block the generation of defective pixels by sorting out defective chips prior to moving the micro-LED chips to the panel, and can reduce the cost and time of the micro-LED defective pixels repair process
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