TSV Dual Stacking TC Bonder is high-precision bonding equipment using 3D TSV, the latest semiconductor packaging technology. This product is optimized for production of large capacity memory semiconductors for DRAMs used in ultra-high capacity server (128GB) and latest model smartphones by solving technical problems such as vibrations caused by two bonding heads running simultaneously, thereby allowing doubled productivity, miniaturized equipment, and ultra-precision bonding compared to existing counterparts., equipment miniaturization and ultra-precision bonding.

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HANMI Semiconductor’s 3rd generation flip chip bonder 3.0 is features upgraded performance in eight items including significantly improved productivity and precision compared to previous models, and thinner and small die with improved handling capability, built-in self-diagnosis system and improved vision test function for users’ convenience, thus receiving good responses from customers in Taiwan where a lot of high-end packages are produced.

superior quality that increases braking power and wear resistance at reasonable prices.
In addition to upgrading the existing core industries such as textiles and machinery, EXCO is also focusing on laying the groundwork for the expansion of the exhibition center to keep pace with changes in the industrial structure of Daegu City that seeks to become a city to lead the 4th Industrial Revolution. Such efforts include planning new exhibitions on the future growth engine industries such as future automobile, water, medical, robot, and Internet of Things (IoT), and expanding the pre-existing exhibitions in terms of both quantity and quality.
In addition, EXCO is also making efforts to hold large-scale international conferences that have been providing the impetus for the development of new exhibitions through strengthened cooperation with the Daegu Convention Bureau. EXCO also intends to promote international conferences related with local and future growth engine industries based on the experience from organizing three energy-related international events including the World Energy Congress Daegu (WEC Daegu 2013), 7th World Water Forum, and 2021 World Gas Conference.

BEXCO is situated in the heart of Busan’s fastest-growing and most dynamic area. The Center features convenient amenities, beautiful scenery of nature and beaches of Haeundae and Gwanganri, 5-star-hotels and more accommodation to suit all budgets, shopping centers and other attractions for leisure and vacation.



double knife gate valve is one of the representative gate valves, mainly used for transfer lines for ash and slurry from mills at power plants. There are three types – metal-to-metal seats, metal-to-rubber cushion seats and metal-to Ptfe-seats. Total Engineering also holds a patent for long knife gate valves.
manganese and aluminum go into the material and can be manufactured using a conventional steelmaking process. In particular, medium manganese steel has an advantage of easily forming crystal grains of several hundred micrometers to several micrometers, which are important for super-plasticity.

