[INQ. NO. 1803M01] HANMI Semiconductor’s flip chip bonder is a core device used in semiconductor packaging process for smart devices, CPU, application process (AP), etc. Small and thin compared with existing wire bondings by using an assembly type flip-chip packaging that connects printed circuit board (PCB) to the solder ball bumper, it is essential equipment for production of semiconductor chips for mobile devices such as smartphones and tablet PCs.
HANMI Semiconductor’s 3rd generation flip chip bonder 3.0 is features upgraded performance in eight items including significantly improved productivity and precision compared to previous models, and thinner and small die with improved handling capability, built-in self-diagnosis system and improved vision test function for users’ convenience, thus receiving good responses from customers in Taiwan where a lot of high-end packages are produced.
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optimization. Its dimensions are 765 x 500 x 775 (mm).
large size mold & die production so that it is able to set various sizes of work material. Magazines are available in various specifications, which enables configuration of magazine options according to tool specification.


used in the process to inject cooling water to chill the heated molds. Aluminum melts at 660°C, which means that the repeated casting process keeps the molds heated at high temperature, and may hinder separation of the components from the molds. The cooler is needed to ease the separation process by injecting water into the molds to cool them down, thus decreasing the defect rate, enhancing productivity, and prolonging the durability of the molds.
compared to other types of chrome plating.
Warranties for battery, drive motor and inverter last for up to 7 years or 150,000 km. Power Plaza provides lifetime service for EV components such as OBC, PDU, LDC, BMS, dashboard module, etc.


